Microelectronic Assembly

Teledyne Labtech is unique in offering a complete microelectronic assembly capability. This includes MMIC die-placement, wire bonding, ribbon bonding, wedge bonding and ball bonding.

This capability ensures that any RF/Microwave PCB and assembly meets with the most demanding defence and space applications.

Combining innovation with engineering excellence, we offer advanced electronic components.

Singapore - Head Office

Malaysia

Vietnam

Thailand Office