Ultraband's power devices are built on GaN-on-SiC in depletion-mode (D-mode) and cascode structures spanning 650 to 1200 V, targeting high efficiency, low switching loss and long-term reliability. Ultraband cites breakdown above 1200 V and on-resistance of 30 to 150 mOhm for the platform, with 1700 V targets for EV chargers.
Both released HEMTs carry a 20 A maximum drain current and are supplied as bare die for standard die-attach, so they can be integrated into power modules alongside drivers and cascode MOSFETs.
Emerges supplies the full Ultraband range, so power and RF teams can source GaN devices from one authorised distributor.
650 V depletion-mode GaN-on-SiC HEMT with 80 mOhm RON and 20 A ID max, bare die.
1200 V depletion-mode GaN-on-SiC HEMT with 120 mOhm RON and 20 A ID max, bare die.
| Part number | VBD | RON | Ciss | Coss | VGS(th) | ID max | Package | Status |
|---|---|---|---|---|---|---|---|---|
| UPDC4G48A8 | 650 V | 80 mOhm | 243 pF | 26 pF | -16 V | 20 A | Bare die | Available |
| UPDC5G78B1 | 1200 V | 120 mOhm | 248 pF | 17 pF | -14 V | 20 A | Bare die | Available |
Ultraband currently lists two D-mode GaN-on-SiC HEMTs: the 650 V UPDC4G48A8 (80 mOhm) and the 1200 V UPDC5G78B1 (120 mOhm), both rated at 20 A.
Both released devices are supplied as bare die for standard die-attach in power modules. Contact us about packaging options.
Yes. Both are depletion-mode devices with negative threshold voltages (-16 V and -14 V). Use a negative gate drive or a cascode with a low-voltage MOSFET for normally-off operation.
Power systems, renewable energy inverters, EV charging and on-board chargers, industrial control and aerospace and defence power conversion.