Teledyne Labtech RF and Microwave PCBs

Need reliable RF and microwave printed circuit boards for high frequency programs. Emerges supplies Teledyne Labtech solutions across APAC with local engineering support. Expect proven RF PCB manufacturing, advanced materials, precise mechanical features and microwave testing that keeps your design on target.
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+65 6749 681
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enquiry@emerges.com.sg
Office Address
6 Ubi Rd 1, #05-07 Wintech Centre, Singapore 408726
Clear shot of a green PCB with visible connectors and chips, including a large "TeleDyne" component at the center, surrounded by other electronic parts.

Why choose Teledyne Labtech with Emerges

  • Dedicated RF and microwave PCB manufacturing with a long track record
  • Design, assembly, testing and thermal management in one platform
  • Local selection help, documentation and logistics for APAC buyers
  • Prototype to volume routes with consistent quality and traceability
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PCB capabilities at a glance

Metal backed RF PCBs including aluminium, brass, copper, copper invar copper and copper moly copper, with plated through holes to the metal backing

Multilayer RF PCBs with PTFE and LCP, mixed dielectric stacks, blind and buried vias, metal core options, copper coins and filled vias for thermal paths

Wire bondable finishes with optional planar resistor technology such as Ohmega Ply and Ticer Foil
performance

Laser drilling and ablation to expose buried features with tight dimensional control

Materials and Stack Ups

Labtech supports a wide range of RF laminates. Typical families include PTFE with ceramic fillers, LCP and other engineered dielectrics. Mixed dielectric multilayers can pair RF substrates with multifunction epoxy or high temperature laminates to balance cost and performance.
Note: Material selection and fusion bonding methods for PTFE and LCP help maintain dimensional stability and impedance control in multilayer stacks.
A high-detail image of stacked PCBs with visible capacitors, resistors, and a central "TeleDyne" microchip, showing advanced electronic assembly.

A detailed view of a double-layered green PCB featuring TeleDyne chips, capacitors, and connectors, showing intricate electronic circuitry.

Where these PCBs excel

  • Radar, EW and SIGINT platforms
  • Satellite and space payloads
  • Avionics and defence systems
  • 5G and microwave backhaul
  • Test and measurement front ends and fixtures

Design for Manufacture Support

Get early guidance on stack up, controlled impedance, thermal paths and mechanical features such as waveguide pockets and coins. Our team applies DFM advice at pre pre-sales stage so your layout lands within process limits for the first time.
ADD YOUR ENQUIRY PRODUCTS
A high-resolution image of a stacked green PCB with advanced microelectronics, including the "TeleDyne" branded chip at the center.

How we engage

Share frequency band, power, environment and length

Confirm materials, metal backing, mechanical features and finish

We propose a stack and routing plan with a clear quote

We deliver and support inspection and acceptance

Frequently asked questions

Yes. Options include aluminium, brass, copper and advanced metal backings with plated through holes where needed.

Yes. PTFE or LCP can be combined with other laminates to balance performance and cost.

Large format panels and bonded antenna structures up to around 100 by 1800 millimetres are supported.

Yes. Wire bondable gold and planar resistor technologies such as Ohmega Ply and Ticer Foil are available.

Yes. Microwave testing to 40 gigahertz is available by request.

Combining innovation with engineering excellence, we offer advanced electronic components.
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